Electronics Forum: solder problem (Page 356 of 507)

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 08:33:14 EDT 2005 | pjc

Is not a problem, I've done it. Be sure the insertion tooling and cut&clinch tooling are set to proper distances from the board. If proper, no deflection of PCBA should be observered during AI. Obviously, your AI Operator must be more careful with PC

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 10:00:28 EDT 2005 | slthomas

I'm curious about one thing. What kind of components are on the bottom, how many are there, and how are you processing (in particular how do you get glue and paste on) them? Edited to add: You shouldn't have any problems (assuming your tooling heigh

caps moving from pads

Electronics Forum | Wed Sep 21 08:43:46 EDT 2005 | kmeline

We are having problems with a 1210 cap moving as far as a 1/4 inch from its pads during reflow. We have verified the placement before reflow. They will tombstone some of the time. There are smaller and larger parts around this location and none of th

Wrinkles on soldered BGA ball joints

Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef

Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti

SMT tape boards!

Electronics Forum | Mon Oct 24 11:00:11 EDT 2005 | rlackey

You can't really use a pasted board to troubleshoot the program as any components not on target simply slide off with machine vibration and movement as they won't be held by the solder paste. Whereas on double sided sticky tape they remain in place

lead free selective soldering

Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug

I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap

Dip Soldering Advice

Electronics Forum | Tue Nov 15 09:50:40 EST 2005 | chunks

Good ol'Wenesco. That's one of my old products they have in their advertising. The tricky part about dip process is in the fluxing. Spray fluxing a populated board from the bottom looking up can be a challenge. You'll notice the areas you missed

SN100C vs. SAC 305 wave soldering

Electronics Forum | Thu Dec 29 11:54:31 EST 2005 | Cmiller

We bought the lead free pots for the Ersa machine and change back and forth. We had a lot of problems running SAC305 in the Ersa. It seems to create a ton of dross and you need to frequently clean and flux the nozzles. I would really like some feed

SN100C vs. SAC 305 wave soldering

Electronics Forum | Fri Jan 20 09:58:48 EST 2006 | adlsmt

We are using SAC for reflow because of the lower temp and better wetting and copper disolution is not so much an issue in reflow. There is not much difference in the alloys and they can be mixed with no problems. I assume any supplier of SN100C cou

Solder Paste Evaluation

Electronics Forum | Wed Jan 11 10:08:58 EST 2006 | samir

I agree with URL. We made a mistake years ago paying a consultant for something that can be done your in-house technical staff. The consultant took a bunch of notes and suggested we all wear "finger cots". His solution didn't help us with our prob


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